STEFANO GRIVET TALOCIA

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Professore Ordinario (L.240)

Coordinatore di Corso di Dottorato (Collegio di Dottorato INGEGNERIA ELETTRICA, ELETTRONICA E DELLE COMUNICAZIONI)

+39 0110904104 / 4104 (DET)

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Stefano Grivet-Talocia ha conseguito la laurea (110 e lode) in ingegneria elettronica (1994) e il dottorato in ingegneria elettronica e delle comunicazioni (1998) presso il Politecnico di Torino. Dal 1994 al 1996, ha lavorato presso NASA/Goddard Space Flight Center, Greenbelt, MD, USA. Attualmente è professore ordinario di Elettrotecnica presso il Politecnico di Torino.

Stefano Grivet-Talocia è autore o coautore di circa 200 pubblicazioni internazionali con referee, tra cui 63 articoli su rivista internazionale (singolo autore di 12) e una monografia di ricerca (il primo libro pubblicato su "Passive Macromodeling"). Ha tenuto diversi seminari, corsi e tutorial presso congressi internazionali e istituzioni pubbliche o private, tra cui NOAA, NASA, EADS, INTEL, IBM, MIT. I suoi attuali interessi di ricerca comprendono la macro-modellazione passiva di strutture di interconnessione concentrate e distribuite, tecniche di riduzione d'ordine, modellistica e simulazione di campi, circuiti e loro interazioni, wavelet, trasformazioni tempo-frequenza e relative applicazioni.

Stefano Grivet-Talocia è stato Associate Editor per le IEEE Trans. EMC (1999-2001) ed è Associate Editor per le IEEE Trans. CPMT (dal 2016). E' stato General Chair delle conferenze SPI2016 e SPI2017. È stato membro dei TPC di numerose conferenze internazionali, tra cui DATE, ICCAD, SPI ed EPEPS.

È IEEE Fellow e membro della Giunta del Gruppo Nazionale di Elettrotecnica (ET). Ha ricevuto numerosi premi, tra cui tre IBM SUR Grant Awards consecutivi (2007-2009), un Best IEEE Transactions Paper Award, vari Best Conference Paper Awards e due URSI Young Scientist Awards.

È attivamente impegnato in diverse attività di trasferimento tecnologico. Oltre a vari contratti di ricerca con partner industriali (tra cui NOKIA, HITACHI, INTEL, IBM), è stato co-fondatore (2007) e presidente della società Spin-off denominata IdemWorks, fino all'acquisizione da parte di CST AG nel 2016.

Settore scientifico discliplinare ING-IND/31 - ELETTROTECNICA
(Area 0009 - Ingegneria industriale e dell'informazione)
Identificativi ORCID: 0000-0002-5463-3810
Scopus Author ID: 7003526566
WoS ResearcherID: M-1480-2015
Linee di ricerca
  • Macromodeling. S. G.-T. has co-authored the first book entirely dedicated to Macromodeling, published in 2016. The term “Macromodeling” denotes methods and algorithms for the generation of black-box models or equivalent circuits starting from some “external” characterization of a given structure at few accessible “ports”. These characterizations can be in time or frequency domain, coming from either simulation (e.g., by solving first-principles models such as field equations) or direct measurements. The resulting macromodels are essential for design and verification flows via system-level simulations. Macromodeling techniques have been mainly finalized to Electromagnetic Compatibility and Signal/Power Integrity verification of complex electronic systems.
  • Methods for simulation of fields and circuits. This research activity provides a complementary approach to the mainstream macromodeling approach by the Author. The main objective is indeed the reduction of the computing time that is required by conventional simulation techniques for the numerical solution of differential problems, still preserving the possibility of accessing unknowns or variables that are inside the structure of interest.
 
 Fast simulation of transmission lines. S. G.-T. is the main developer of the Generalized Method of Characteristics technique denoted as TOPLine for the fast transient simulation of multiconductor transmission lines with frequency-dependent param- eters. The technique is based on delay extraction and rational approximations of suitable transfer functions. TOPLine was demonstrated to outperform more traditional modeling and simulation schemes with no loss of accuracy. TOPLine is now embedded in some proprietary circuit solvers such as IBM PowerSPICE.
 
 Waveform Relaxation. S. G.-T. is the main developer of several numerical schemes based on distributed macromodels and Waveform Relaxation for fast transient analysis of complex high-speed channels terminated by nonlinear drivers and receivers. These algorithms outperform standard circuit solvers of the SPICE class and provide a comprehensive framework for Signal Integrity verification.
 
 System-level simulation. S. G.-T. is the main developer of a hybridization scheme of full-wave Finite-Difference Time-Domain solvers with behavioral models of digital drivers and receivers. Main theory includes a stability analysis for guaranteeing convergence of the simulation. This technique allows modeling and simulation of Electromagnetic Interference on interconnected structures, including the effects of nonlinear and dynamic terminations.
  • Passivity of lumped macromodels. The publications by the Author on passivity enforcement are considered as a reference for the scientific community. Non-passive macromodels can be the root cause for instabilities and lack of convergence in system-level simulations. It is possible to design and realize a termination network that drives to instability any non-passive multiport model. Expli
  • Parameterized macromodeling. The availability of electrical models including in a closed form the influence of geometry and/or material parameters is of paramount importance for the scientific and industrial community. These models constitute a fundamental enabling factor for the optimization and tuning of the performance of a given system via fast simulations. Several schemes have been developed for the introduction of such parameters in lumped and distributed macromodels, with emphasis on electrical interconnect structures. Lossy multiconductor transmission lines can be modelled through a direct parameterization of characteristic admittance and propagation operators of the line. These techniques have been extended to more general components and structures that do not obey the telegraphers’ equa- tions, both for passive (linear) devices and interconnects, and for complex nonlinear analog blocks under stationary or non-stationary small-signal operation.
Competenze

Settori ERC

PE7_4 - (Micro and nano) systems engineering PE7_6 - Communication technology, high-frequency technology PE7_2 - Electrical engineering: power components and/or systems PE7_3 - Simulation engineering and modelling

Parole chiave libere

Behavioral modeling Electromagnetic compatibility Macromodeling Model order reduction Numerical modeling Passivity Power integrity Signal integrity Transmission lines Wavelets
Responsabilità scientifiche e altri incarichi

Premi e riconoscimenti

  • Best Associate Editor Award - IEEE Transactions on Components, Packaging and Manufacturing Technology conferito da IEEE Electronic Packaging Society, Italia (2020)
  • Best Conference Paper Award conferito da 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose (CA) USA, Stati Uniti (2020)
  • IBM Shared University Research Award conferito da IBM, Stati Uniti (2009)
  • IBM Shared University Research Award conferito da IBM, Stati Uniti (2008)
  • Best EPEP conference paper award conferito da IEEE 17th Electrical Performance of Electronic Packaging Conference, Stati Uniti (2008)
  • IBM Shared University Research Award conferito da IBM, Stati Uniti (2007)
  • Best EPEP conference paper award conferito da IEEE 17th Electrical Performance of Electronic Packaging Conference, Stati Uniti (2007)
  • IEEE Transactions on Advanced Packaging Best Paper Award conferito da IEEE Components, Packaging and Manufacturing Technology Society, Stati Uniti (2007)
  • Best symposium paper conferito da 17th International Zurich Symposium on Electromagnetic Compatibility, Singapore (2006)
  • URSI Young Scientist Award conferito da International Union of Radio Science, Belgio (1999)

Partecipazioni scientifiche

Comitati editoriali

  • IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. PART C. MANUFACTURING (2018-), Associate Editor di rivista o collana editoriale
  • IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY (1999-2001), Associate Editor di rivista o collana editoriale

Congressi

  • 21st IEEE Workshop on Signal and Power Integrity (SPI), Program chair (presidente/responsabile del comitato scientifico)
  • 20th IEEE Workshop on Signal and Power Integrity (SPI), Program chair (presidente/responsabile del comitato scientifico)