EMI propagation in system-on-chips (SoCs)
System-on-chips (SoCs) make available on the same silicon die complete electronic systems. In facts, driven by reasons of cost and performance, and because of semiconductor technological advance, complex circuits that include digital, analog and radio-frequency (RF) sections can be integrated together on the same substrate.
Furthermore, such SoCs are requested to properly operate in high electromagnetic polluted environments where disturbances are usually collected by system cables and a part of these can reach SoCs terminals impairing their nominal operation. In this context, the integration of both analog, RF circuits and digital circuits on the same die not creates some difficulties since the common substrate is an efficient propagation path for the incoming RF interference.
This research activity is aimed to characterize the EM interference propagation path within the silicon die to derive insight into induced failure mechanisms of modern SoCs.